HCLTech at ChipEX 2023: Supercharging your semiconductor journey

Supercharging your semiconductor journey

The rapid adoption of AI, 5G, cloud and other new age technologies is driving unprecedented transformation in the semiconductor industry. Semiconductor giants across the globe are on the constant lookout for more advanced, efficient and sophisticated chips to power the next generation devices and systems. Owing to this surge in demand, heavy investments are being made in research and development of high-performance chips that meet the challenges and unique needs of today’s enterprises.

As a pioneer in the semiconductor space and with deep domain expertise spanning over two decades, we know what our customers need even before they realize the need. We work with them closely to identify and address the underlying business challenges and help them with the right set of market-ready solutions, capabilities and infrastructure to take their innovation journey to the next level. Our team of experts is well-equipped to co-innovate with our customers in sustaining their current product portfolio by handling the derivative designs, while also catapulting their efforts for futuristic product development.

Visit our booth F8 at ChipEx2023 to learn how we help our customers reimagine the future of chip design with cloud-enabled solutions.

The HCLTech advantage

Our engineers have proven, hands-on domain experience in semiconductor engineering with in-depth knowledge of the latest technologies, design methodologies, modeling languages and verification techniques used in the industry. Our state-of-the-art labs, including the silicon validation labs, ATE tester labs and qual labs, help our customers get not just a well-designed silicon chip, but also a fully qualified one that can be manufactured seamlessly. Our foundry and OSAT (Outsourced Semiconductor Assembly and Test) partners help customers with a comprehensive end-to-end turnkey silicon design solution by adopting a mix of consulting-led as well as technology implementation-based approaches.

25+ years of strong domain experience
Largest engineering team in the industry dedicated for semiconductor domain
Trusted by customers across the globe
Member of TSMC DCA Alliance
200+ tapeouts with proven experience across multiple industry domains

Join us for the speaking session

Location: Tel Aviv Expo-Centre | May 9, 2023

AI based on-chip analytics for remaining useful life prediction

In this session, Sai Prasanna G, HCLTech will share insights on the growing semiconductor chip complexity demands and predictive maintenance approaches that provide guaranteed chip functionality and enhanced predictability for chip failure due to aging or reliability issues. Having a mechanism in place which can predict aging effects, hardware random errors, silent errors, production faults, etc. will certainly lead to better post-silicon validation and predictive maintenance as part of the silicon telemetry. Sai will also discuss how enabling the on-chip analytics and AI models helps in predicting the Remaining Useful Life (RUL) of the chip and RUL prediction for better Baas (Battery as a Service).

Register now