Job description:

IC Package Design Engineer Experience with Mentor Expedition IC Package Design experience with Mentor Graphics Layout, XPD, XSI tools Good understanding of packagesubstrate design and package assembly rules related to flip chip designs. Exposure to different package technologies such as MCM, flip chip wire bond, 3D, 2.5D etc., added advantage Expertise in High Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies. Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES. Good Exposure to Stackup design, DFM, DFA rules and adherence. Should have expertise in constraint setting in layout tool.IC Package design / Substrate design experience is mandatoryShould be able to work with customer SPOC independentlyShould have experience in all phases of Package PCB design phases (from net-in to Gerber generation)

• To work closely with stakeholders to understand and refine design requirements.
• To develop prototypes and proof-of-concept implementations to validate design decisions.
• To mentor junior designers ,share knowledge and expertise through training sessions and documentation.
• To collaborate with cross functional teams and other stakeholders to align software design with overall project goals.
• To work with quality assurance teams to establish and maintain high-quality.